Laminated Polystyrene Insulation Board
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Products
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
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Floor Heating Extruded XPS Board
Beipeng Group introduced the Berstorff productionline in 2008,Beipeng® XPS insulation foamboard contains the additional benefit of beingmanufactured with a blowing agent formulationthat delivers a 90% reduction to Global WarmingPotential(100 years),including the completeelimination of HCFCS or HBCD.
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