Beipeng® Light Weight GEPS Foam board
Thermal Conductivity ≤0.033 W/m2·K
Dimensional stability ≤3%
Tensile strength ≥0.10 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Graphite Extruded Insulation Board (SXPS)
56666666Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Extruded Polystyrene Board(SEPS)
Beipeng® Extruded Polystyrene (XPS)insulationsare closed-cell, high stability, moisture-resistantrigid foam boards, Different product specificationscan be well formulated according to a wide varietyof constructions or usage situations.Beipeng Group introduced the Berstorff productionline in 2008,Beipeng® XPS insulation foamboard contains the additional benefit of beingmanufactured with a blowing agent formulationthat delivers a 90% reduction to Global WarmingPotential(100 years),including the completeelimination of HCFCS or HBCD.
