Beipeng® Waterproof Backing Board is made with Beipeng® extruded polystyrene board as the core, covered with alkali-resistant mesh and a specially formulated high-polymer mortar coating. The uniform and dense pores of the Beipeng® extruded polystyrene board create a closed-cell structure that does not absorb water and prevents water vapor penetration. The alkali-resistant mesh increases the strength and rigidity of the Beipeng® Waterproof Backing Board, and the surface polymer waterproof mortar is fully compatible with any modified polymer mortar, tile adhesive, or other decorative coatings. Beipeng® Waterproof Backing Board is commonly used in indoor applications where waterproofing and tiling are required for walls, floors, countertops, and other surfaces clad in ceramic tiles and stone.
Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Beipeng® high-intensity floor heating extruded XPS board
Thermal Conductivity ≤0.035W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.10 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
56666666Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Beipeng® Waterproof Backing Board is made with Beipeng® extruded polystyrene board as the core, covered with alkali-resistant mesh and a specially formulated high-polymer mortar coating. The uniform and dense pores of the Beipeng® extruded polystyrene board create a closed-cell structure that does not absorb water and prevents water vapor penetration. The alkali-resistant mesh increases the strength and rigidity of the Beipeng® Waterproof Backing Board, and the surface polymer waterproof mortar is fully compatible with any modified polymer mortar, tile adhesive, or other decorative coatings. Beipeng® Waterproof Backing Board is commonly used in indoor applications where waterproofing and tiling are required for walls, floors, countertops, and other surfaces clad in ceramic tiles and stone.
Beipeng® Waterproof Backing Board is made with Beipeng® extruded polystyrene board as the core, covered with alkali-resistant mesh and a specially formulated high-polymer mortar coating. The uniform and dense pores of the Beipeng® extruded polystyrene board create a closed-cell structure that does not absorb water and prevents water vapor penetration. The alkali-resistant mesh increases the strength and rigidity of the Beipeng® Waterproof Backing Board, and the surface polymer waterproof mortar is fully compatible with any modified polymer mortar, tile adhesive, or other decorative coatings. Beipeng® Waterproof Backing Board is commonly used in indoor applications where waterproofing and tiling are required for walls, floors, countertops, and other surfaces clad in ceramic tiles and stone.
High pressure resistant underfloor heating module
BeiPeng® High-Compression Dry Underfloor Heating Modules are a core materialof an efficient and energy-saving underfloor heating system, specially designed tomeet the requirements of floor heating installation, integrating multiple functionssuch as insulation, thermal conductivity, and compressive resistance. They usehigh-performance extruded polystyrene (XPS) boards as the base material, com-bined with precise processing techniques to form a modular design, providing ahigh-quality solution for the efficient operation and convenient installation of un-derfloor heating systems.Applications of High-Compression Dry Underfloor Heat.ing Modules:New underfloor heating projects: Suitable for underfloor heating in-stallation in residential, commercial buildings, and other structures.Renovationprojects: Presents significant advantages, especially in spaces with limited floorheight.Energy-efficient buildings: ldeal choice for green buildings and low-energybuildings that require higher energy-saving and environmentally friendly performance from the underfloor heating system.
Beipeng® Graphite XPS Insulation Board
Thermal Conductivity ≤0.024 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
