Polystyrene Insulation Board
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Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
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Beipeng® Extruded Polystyrene (XPS)insulationsare closed-cell, high stability, moisture-resistantrigid foam boards, Different product specificationscan be well formulated according to a wide varietyof constructions or usage situations.Beipeng Group introduced the Berstorff productionline in 2008,Beipeng® XPS insulation foamboard contains the additional benefit of beingmanufactured with a blowing agent formulationthat delivers a 90% reduction to Global WarmingPotential(100 years),including the completeelimination of HCFCS or HBCD.
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Graphite Extruded Insulation Board (SXPS)
56666666Thermal Conductivity ≤0.030 W/m2·K<br> Dimensional stability ≤1.5%<br> Compressive strength 200 kPa<br> Tensile strength ≥0.20 Mpa<br> Water absorption ≤1.5%<br> Combustion performance B1, B2<br> Density 22-35 kg/m2<br> Length 1200 mm<br> Width 600 mm<br> Thickness 20mm<br> Dimensional stability ≤3%<br> Compressive strength ≥100kPa<br> Tensile strength ≥0.10 Mpa<br> <img src= “https://omo-oss-image.thefastimg.com/portal-saas/pg2024032716372857070/cms/image/b9ca91e8-8dcb-4b54-80b7-2ed5f9a8ae01.jpg” >
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Floor Heating Extruded XPS Board
Beipeng Group introduced the Berstorff productionline in 2008,Beipeng® XPS insulation foamboard contains the additional benefit of beingmanufactured with a blowing agent formulationthat delivers a 90% reduction to Global WarmingPotential(100 years),including the completeelimination of HCFCS or HBCD.
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