XPS Extruded Board
Key words:
Thermal Conductivity ≤0.030 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
Different product specificationscan be well formulated according to a wide varietyof constructions or usage situations.Beipeng Group introduced the Berstorff productionline in 2008,Beipeng® XPS insulation foamboard contains the additional benefit of beingmanufactured with a blowing agent formulationthat delivers a 90% reduction to Global WarmingPotential(100 years),including the completeelimination of HCFCS or HBCD.
