Graphite extruded polystyrene insulation board
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Thermal Conductivity ≤0.030 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
