High intensity floor heating module
Key words:
Beipeng® high-intensity floor heating extruded XPS board
Thermal Conductivity ≤0.035W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.10 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
High pressure resistant underfloor heating module
BeiPeng® High-Compression Dry Underfloor Heating Modules are a core materialof an efficient and energy-saving underfloor heating system, specially designed tomeet the requirements of floor heating installation, integrating multiple functionssuch as insulation, thermal conductivity, and compressive resistance. They usehigh-performance extruded polystyrene (XPS) boards as the base material, com-bined with precise processing techniques to form a modular design, providing ahigh-quality solution for the efficient operation and convenient installation of un-derfloor heating systems.Applications of High-Compression Dry Underfloor Heat.ing Modules:New underfloor heating projects: Suitable for underfloor heating in-stallation in residential, commercial buildings, and other structures.Renovationprojects: Presents significant advantages, especially in spaces with limited floorheight.Energy-efficient buildings: ldeal choice for green buildings and low-energybuildings that require higher energy-saving and environmentally friendly performance from the underfloor heating system.
Beipeng®HFC high-strength polymer detachableinsulation composite board
Impact resistance/times 10J Thermal conductivity ≤0.030 W/m ·K Compression strength ≥0.20 Mpa
