XPS
Key words:
Beipeng® high-intensity floor heating extruded XPS board
Thermal Conductivity ≤0.035W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.10 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
Key words:
Thermal Conductivity ≤0.030 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
Key words:
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K Dimensional stability ≤1.5% Tensile strength ≥0.20 Mpa Heftynest extruded board process-CO2 foaming process No secondary foaming phenomenon
Key words:
