Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
