Beipeng® rockwool insulation board.
Thermal Conductivity ≤0.040 W/m2·K
Hydrophobic rate ≥98%
Tensile strength ≥7.5 Mpa
Beipeng®Lightweight partition board
Impact resistance/times 10J
Thermal conductivity ≤0.030 W/m ·K
Compression strength ≥0.20 Mpa
Beipeng®HFC high-strength polymer detachableinsulation composite board
Impact resistance/times 10J
Thermal conductivity ≤0.030 W/m ·K
Compression strength ≥0.20 Mpa
Beipeng® Light Weight GEPS Foam board
Thermal Conductivity ≤0.033 W/m2·K
Dimensional stability ≤3%
Tensile strength ≥0.10 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Thermal Conductivity ≤0.024 W/m2·K
Dimensional stability ≤1%
Tensile strength ≥0.10 Mpa
Beipeng® high-intensity floor heating extruded XPS board
Thermal Conductivity ≤0.035W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.10 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
