Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
56666666Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Beipeng® Graphite XPS Insulation Board
Thermal Conductivity ≤0.024 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
xps extruded polystyrene insulation boards
Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Beipeng® 023 Graphite XPS Insulation Board
Thermal Conductivity ≤0.023 W/m2·K
Dimensional stability ≤1.5%
Tensile strength ≥0.20 Mpa
Heftynest extruded board process-CO2 foaming process
No secondary foaming phenomenon
Beipeng® Extruded Polystyrene (XPS)insulationsare closed-cell, high stability, moisture-resistantrigid foam boards, Different product specificationscan be well formulated according to a wide varietyof constructions or usage situations.Beipeng Group introduced the Berstorff productionline in 2008,Beipeng® XPS insulation foamboard contains the additional benefit of beingmanufactured with a blowing agent formulationthat delivers a 90% reduction to Global WarmingPotential(100 years),including the completeelimination of HCFCS or HBCD.
Graphite Extruded Insulation Board (SXPS)
56666666Thermal Conductivity ≤0.030 W/m2·K
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
Dimensional stability ≤1.5%
Compressive strength 200 kPa
Tensile strength ≥0.20 Mpa
Water absorption ≤1.5%
Combustion performance B1, B2
Density 22-35 kg/m2
Length 1200 mm
Width 600 mm
Thickness 20mm
Dimensional stability ≤3%
Compressive strength ≥100kPa
Tensile strength ≥0.10 Mpa
